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austriamicrosystems AG is now ams AG The technical content of this austriamicrosystems datasheet is still valid. Contact in

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 9 of 25 Typical Characteristics of Line Loss Compensation Figure 6 Typical T x Ga

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 10 of 25 Typical Application Complex Impedance (270 W + 750 W // 150 nF) Only the co

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 11 of 25 Programming Procedures Procedure Principles The procedures for utilizing the

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 12 of 25 Timing Diagrams LD Dialing LD Dialing with Access Pause MF Dialing tID

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 13 of 25 Flash Repeat Dialing (not AS2535) tAP MUTE HS/DPN Power Down tRP Numb

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 14 of 25 Electrical Characteristics Absolute maximum ratings Positive Supply Voltage

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 15 of 25 AC Characteristics (I LINE = 15 mA; f = 800 Hz unless otherwise specified) S

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 16 of 25 AC Characteristics (cont´d) (ILINE = 15 mA; f = 800 Hz unless otherwise spec

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 17 of 25 Symbol Parameter Conditions Min Typ Max Units tFD Flash Duration 1

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 18 of 25 Test Circuit Figure 9 Test Circu it ams AG Technical content still valid

Revision 8.10 Page 1 of 25 austriamicrosystemsGeneral Description The AS253x is a CMOS integrated circuit that contains all the functions needed to

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 19 of 25 Characteristic Curves (Typical) 0123456780 10 20 30 40 50 60 70 80 90 10

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 20 of 25 Bond Pad Layout Bond Options Product Version Bond Pad Connection AS2533

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 21 of 25 Sizes and Coordinates Die Size: 3.190mm x 2.975mm Bond Pad Size: 85µm

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 22 of 25 Vertical Structure of Bond Pads Process CXQ/CXB – FAB B General

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 23 of 25 Conditions for Delivery as Dice on Foil, sawn Die thickness 380 ± 20µm Back

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 24 of 25 Packaging The device is available in the packages outlined below (not to sca

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 25 of 25 Contact Information austriamicrosystems AG Business Unit Communications A 81

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 2 of 25 Pin Description Pin # Symbol Function 4 VDD Positive Voltage Supply This

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 3 of 25 Pin # Symbol Function 17 18 19 20 R4 R3 R2 R1 Keyboard Rows (see key arrang

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 4 of 25 Functional Description Keyboard Connections (Either VOL or +/– keys) Key clo

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 5 of 25 Keyboard Connections continued (either VOL or +/– keys) Figure 4 Keyboard C

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 6 of 25 Transmit The gain of the transmit path is 37 dB for 600 Ω line termination fr

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 7 of 25 Last Number Redial LNR is a facility that allows resignalling of the last man

Data Sheet AS25 33-36 austriamicrosystems Revision 8.10 Page 8 of 25 Low group Digit 1-2-3-A 697 Hz Digit 4-5-6-B 770 Hz Digit 7-8-9-C 852 Hz D